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- إرجاع مجاني بسهولة
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الميزات الأساسية
- Precision Alignment: Ensure the platform has accurate alignment features to properly position the motherboard. This helps in placing the chips back on the correct pads after reballing. Adjustable Heating Elements: Look for a platform with adjustable temperature control to precisely manage the heat required for different components and soldering processes. Vacuum Pump: A vacuum pump or suction mechanism can be very useful for removing and positioning chips without damaging them. High-Quality Build: A durable, well-built frame is essential for consistent results and longevity of the tool. Compatibility: Verify that the platform can accommodate the size of the iPhone X/XS/XS Max boards and the specific BGA chips used in these models. Ease of Use: Features like a clear visibility of the work area and easy adjustments can make the reballing process more manageable.
Frame Reballing Platform
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