الناشر | Springer-Verlag New York Inc. |
رقم الكتاب المعياري الدولي 13 | 9781461492627 |
رقم الكتاب المعياري الدولي 10 | 1461492629 |
اللغة | الإنجليزية |
وصف الكتاب | This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail. |
عن المؤلف | Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences. |
تاريخ النشر | 31 Jul 2014 |
عدد الصفحات | 402 |
Packaging Of High Power Semiconductor Lasers Hardcover English by Xingsheng Liu - 31 Jul 2014