Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
Electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Device to the heat sink or chassis
By increasing the overall efficiency of the component