Publisher | John Wiley and Sons Ltd |
ISBN 13 | 9780470167786 |
ISBN 10 | 0470167785 |
Book Description | Electroplating is the coating of an electrically conductive object with a layer of metal using electrical current resulting in a thin, smooth, even coat of metal on the object. This text covers the methods and applications of electrochemical deposition of metals, alloys, semiconductors, and conductive polymers. It provides practical advice and some theoretical background to those entering the field of electrodeposition. Like previous editions, the fifth edition will be the first stop reference for the electroplating community. This fully updated edition includes significant advances in the field, from emerging electrodeposition techniques to electroplating in medical and data storage industries. |
Editorial Review | This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical , the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. (Digital Post Production, 23 November 2010) "With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject". (GNT, 23 November 2010) |
About the Author | MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He has published over 120 research papers, holds four patents, and has served as associate editor for the Journal of The Electrochemical Society, Electrochemical and Solid-State Letters, and as coeditor of the Canadian Journal of Physics. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating (both by Wiley). MILAN PAUNOVIC, PhD, had, until his recent retirement, worked on electrochemical metal deposition for over four decades, most recently in the Electrodeposition Technology Department at IBM's T. J. Watson Research Center, and previously at the University of Pennsylvania, Reynolds Metals, Kollmorgen, and Intel. In addition to coauthoring, with Mordechay Schlesinger, the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating, Dr. Paunovic has edited symposia proceedings for The Electrochemical Society, published forty-one research papers, and holds seven patents. |