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Packaging Of High Power Semiconductor Lasers Hardcover English by Xingsheng Liu - 31 Jul 2014

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(Original Copy - نسخه أصلية)
Overview
Specifications
PublisherSpringer-Verlag New York Inc.
ISBN 139781461492627
ISBN 101461492629
Book DescriptionThis book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
About the AuthorDr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
LanguageEnglish
AuthorXingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
Publication Date31 Jul 2014
Number of Pages402

Packaging Of High Power Semiconductor Lasers Hardcover English by Xingsheng Liu - 31 Jul 2014

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