Specifications
| Publisher | Springer-Verlag New York Inc. |
| ISBN 13 | 9781461492627 |
| ISBN 10 | 1461492629 |
| Book Description | This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail. |
| About the Author | Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences. |
| Language | English |
| Author | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
| Publication Date | 31 Jul 2014 |
| Number of Pages | 402 |
Packaging Of High Power Semiconductor Lasers Hardcover English by Xingsheng Liu - 31 Jul 2014
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