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Specifications
| Publisher | Artech House Publishers |
| ISBN 13 | 9781608076970 |
| ISBN 10 | 1608076970 |
| Book Description | Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples. |
| About the Author | Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S in electrical engineering from UCLA. |
| Language | English |
| Author | Rick Sturdivant |
| Publication Date | 17-Mar-2014 |
| Number of Pages | 280 |
Microwave And Millimeter-wave Electronic Packaging Hardcover English by Rick Sturdivant - 17-Mar-2014
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