UV80 No-Clean Soldering Solder Paste Flux for Electronics PCB BGA PGA SMD Welding Tool
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Highlights
- High bond strength, good insulation, smooth welding surface. Melting point is slightly higher than soldering tin
- No-clean solder paste with minimal residue and no cleaning required
- Great soldering work tool for mobile phone, PCB, BGA, SMD, electronic repair
- Model: UV80, Weight with case: approx 50g; Case Size: 7.7 x 2.5 cm
Specifications
| Model Number | UV80 |
UV80 No-Clean Soldering Solder Paste Flux for Electronics PCB BGA PGA SMD Welding Tool
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